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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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10 Years
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Home / Products / Phase Changing Materials / High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃ /

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Product Categories

Phase Changing Materials

 [37]

Thermal Conductive Pad

 [155]

Thermal Gap Filler

 [185]

Thermal Conductive Grease

 [27]

Thermal Insulation Materials

 [33]

Thermal Graphite Sheet

 [53]

Thermal Adhesive Tape

 [47]

Thermal Conductive Glue

 [15]

Thermal Conductive Adhesive

 [13]

Thermal Conductive Plastic

 [23]

Sponge Foam Material

 [13]

PET Double Sided Tape

 [11]

Thermal Gap Pad

 [406]

Thermal Conductive Gel

 [21]

Silicone Foam Gasket

 [11]

Silicone Free Gap Filler Pad

 [13]

Shielding Absorbing Materials

 [19]

Thermal Conductivity Sharp Metal

 [2]
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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃
High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃
  • High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃
  • High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃
  • High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃
  • High Frequency Microprocessors 0.95 W/mK Thermal changing materials Low Resistance -25℃ - 125℃
Products Detailed
High Frequency Microprocessors Thermal Interface Pad Low Resistance -25℃ - 125℃ The TIC™800P Series is low melting point thermal interface material. ...
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Product Tags:
thermal compound cpu thermal compound for cpu thermal interface material cpu

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