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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

Manufacturer from China
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10 Years
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Home / Products / Phase Changing Materials / 2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required /

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Product Categories

Phase Changing Materials

 [37]

Thermal Conductive Pad

 [154]

Thermal Gap Filler

 [179]

Thermal Conductive Grease

 [27]

Thermal Insulation Materials

 [33]

Thermal Graphite Sheet

 [53]

Thermal Adhesive Tape

 [47]

Thermal Conductive Glue

 [15]

Thermal Conductive Adhesive

 [13]

Thermal Conductive Plastic

 [23]

Sponge Foam Material

 [13]

PET Double Sided Tape

 [11]

Thermal Gap Pad

 [406]

Thermal Conductive Gel

 [21]

Silicone Foam Gasket

 [11]

Silicone Free Gap Filler Pad

 [13]

Shielding Absorbing Materials

 [19]

Thermal Conductivity Sharp Metal

 [2]
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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
  • 2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
  • 2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
  • 2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
  • 2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
Products Detailed
2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive The TIC™803A Series is low melting point thermal interface material. ...
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Product Tags:
intermediate temperature sofc pcb soldering temperature smd soldering temperature

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