Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness

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Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness

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Brand Name :Ziitek
Model Number :TIC™808G series
Certification :RoHs
Place of Origin :China
MOQ :1000PCS
Price :negotiation
Supply Ability :100000pcs/day
Delivery Time :3-5 work days
Packaging Details :1000pcs/bay
Product Name :Phase Changing Materials
Color :Gray
Thermal Conductivity :5.0 W/mK
Density :2.6g/cc
Temperature range :-25℃~125℃
Thickness :0.127~0.25mmT
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Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

TIC™800G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

TIC800G Series Datasheet-(E)-REV01.pdf

Applications Include:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Features:

For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required

Typical Properties of TICTM800G Series
Product Name TICTM805G TICTM808G TICTM810G TICTM812G Test Method
Color Gray Gray Gray Gray Visual
Thickness 0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
0.012"
(0.305mm)
 
Thickness Tolerance ±0.0008''
(±0.019mm)
±0.0008''
(±0.019mm)
±0.0012''
(±0.030mm)
±0.0012''
(±0.030mm)
 
Density 2.6g/cc Helium Pycnometer
Temperature range -25℃~125℃  
Phase Change Softening Temperature 50℃~60℃  
Thermal Conductivity 5.0 W/mK ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa) 0.014℃-in²/W 0.020℃-in²/W 0.038℃-in²/W 0.058℃-in²/W ASTM D5470 (modified)
0.09℃-cm²/W 0.13℃-cm²/W 0.25℃-cm²/W 0.37℃-cm²/W

Standard Thicknesses:


0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.0012"(0.305mm)
Consult the factory alternate thickness.

Standard Sizes:


10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:


Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.

Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

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