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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

Manufacturer from China
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10 Years
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Home / Products / Thermal Gap Pad / Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc /

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Phase Changing Materials

 [36]

Thermal Conductive Pad

 [153]

Thermal Gap Filler

 [168]

Thermal Conductive Grease

 [27]

Thermal Insulation Materials

 [32]

Thermal Graphite Sheet

 [51]

Thermal Adhesive Tape

 [47]

Thermal Conductive Glue

 [15]

Thermal Conductive Adhesive

 [13]

Thermal Conductive Plastic

 [23]

Sponge Foam Material

 [13]

PET Double Sided Tape

 [11]

Thermal Gap Pad

 [406]

Thermal Conductive Gel

 [20]

Silicone Foam Gasket

 [11]

Silicone Free Gap Filler Pad

 [13]

Shielding Absorbing Materials

 [19]

Thermal Conductivity Sharp Metal

 [2]
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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
  • Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
  • Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
  • Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
  • Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc
Products Detailed
Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant The TIF™500S Series thermally conductive interface ...
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Product Tags:
high density thermoelectric module 3m thermal pad thermoelectric chip

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