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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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10 Years
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Home / Products / Thermal Gap Filler / Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃ /

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Thermal Graphite Sheet

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Thermal Adhesive Tape

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PET Double Sided Tape

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Thermal Gap Pad

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Thermal Conductive Gel

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Silicone Foam Gasket

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Silicone Free Gap Filler Pad

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Shielding Absorbing Materials

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Thermal Conductivity Sharp Metal

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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃
Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃
  • Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃
  • Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃
  • Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃
  • Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃
Products Detailed
Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 Company Profile With a wide range, good quality, ...
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Product Tags:
thermal arc 3 in 1 am3 heatsink heatsink thermal compound

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