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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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10 Years
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Home / Products / Thermal Gap Filler / 2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling /

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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling
2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling
  • 2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling
  • 2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling
  • 2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling
  • 2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling
Products Detailed
2.54mm Thickness Ultrasoft Thermally Conductive Polymers Gap For CPU Heatsink Cooling The TIF100-15-07E thermally conductive interface materials are ...
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best heatsink material heatsink material rigid insulation thermal conductivity

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