Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer
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-50 - 180℃ Continuous Use Temp Acrylic Adhesive Tape with Ceramic Filled Silicone Elastomer
The TIA™808 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
TIA800 Series Datasheet-(E)-REV01.pdf
Features
> Thermal Conductivity: 0.9 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive
Applications
> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting
| Typical Properties of TIA™800 Series | ||||||
| Product Name | TIA™806 | TIA™808 | TIA™810 | TIA™812 | TIA™818 | Test Method |
| Color | White | White | White | White | White | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | *** | ||||
| Composite Thickness | 0.006"/0.152mm | 0.008"/0.203mm | 0.010"/0.254mm | 0.012"/0.304mm | 0.018"/0.457mm | ASTM D751 |
| Specific Gravity | 2.2 g/cc | ASTM D297 | ||||
| Specific Gravity | 1 l/g-K | ASTM C351 | ||||
| Hardness | 50 Shore A | ASTM 2240 | ||||
| Tensile Strength | 450 psi | >600 psi | >600 psi | >600 psi | >600 psi | ASTM D412 |
| Continuous Use Temp | (-58 to 356℉) / (-50 to 180℃) | *** | ||||
| Electrical | ||||||
| Dielectric Breakdown Voltage | >1500 VAC | >3500 VAC | >5000 VAC | >5000 VAC | >5000 VAC | ASTM D149 |
| Dielectric Constant | 5.5 MHz | ASTM D150 | ||||
| Volume Resistivity | 5.0X10" Ohm-meter | ASTM D257 | ||||
| Flame Rating | 94 V0 | equivalent UL | ||||
| Thermal | ||||||
| Thermal Conductivity | 0.9 W/m-K | ASTM D5470 | ||||
| Thermal lmpedance @50psi | 0.21℃-in²/W | 0.35℃-in²/W | 0.82℃-in²/W | 1.23℃-in²/W | 1.83℃-in²/W | ASTM D547 |
