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Dongguan Ziitek Electronical Material and Technology Co., Ltd

Dongguan Ziitek Electronical Material and Technology Co., Ltd. -- Professional TIM Manufacturer

Manufacturer from China
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12 Years
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Home / Products / Thermal Conductive Glue / Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation /

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Phase Changing Materials

 [45]

Thermal Conductive Pad

 [249]

Thermal Gap Filler

 [263]

Thermal Conductive Grease

 [28]

Thermal Insulation Materials

 [48]

Thermal Graphite Sheet

 [52]

Thermal Adhesive Tape

 [47]

Thermal Conductive Glue

 [14]

Thermal Conductive Adhesive

 [16]

Thermal Conductive Plastic

 [23]

Sponge Foam Material

 [13]

PET Double Sided Tape

 [11]

Thermal Gap Pad

 [406]

Thermal Conductive Gel

 [28]

Silicone Foam Gasket

 [17]

Silicone Free Gap Filler Pad

 [13]

Shielding Absorbing Materials

 [20]
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Dongguan Ziitek Electronical Material and Technology Co., Ltd
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation
Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation
  • Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation
  • Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation
Products Detailed
Two-Component High Thermal Conductivity Epoxy Resin Glue Compound For Electronic Components Encapsulation TIETM280-12AB Series is a two-component, ...
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Product Tags:
thermally conductive glue thermal conductive glue thermal bonded

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