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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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10 Years
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Home / Products / Thermal Conductive Glue / 2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D /

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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
  • 2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
  • 2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
  • 2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
  • 2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
Products Detailed
2.5W / mK Low Viscosity Thermal Conductive Glue with -40℃ - 130℃ Service Temperature TIE™ 280-25AB is a two compound, high thermal conductive, low ...
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Product Tags:
heatsink glue adhesive heat transfer adhesive glue thermal adhesive glue

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