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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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10 Years
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Home / Products / Thermal Gap Filler / Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc /

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Phase Changing Materials

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Thermal Conductive Pad

 [155]

Thermal Gap Filler

 [189]

Thermal Conductive Grease

 [27]

Thermal Insulation Materials

 [46]

Thermal Graphite Sheet

 [53]

Thermal Adhesive Tape

 [47]

Thermal Conductive Glue

 [15]

Thermal Conductive Adhesive

 [13]

Thermal Conductive Plastic

 [23]

Sponge Foam Material

 [13]

PET Double Sided Tape

 [11]

Thermal Gap Pad

 [406]

Thermal Conductive Gel

 [22]

Silicone Foam Gasket

 [11]

Silicone Free Gap Filler Pad

 [13]

Shielding Absorbing Materials

 [19]

Thermal Conductivity Sharp Metal

 [2]
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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc
Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc
  • Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc
  • Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc
  • Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc
  • Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc
  • Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc
Products Detailed
Pink 3W/mK High Tack Surface Reduces Contact Resistance Thermal Gap Filler G579 2.10 g/cc The TIF140-30-49U is not only designed to take advantage of ...
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Product Tags:
pcb heat conducting adhesive high thermal conductivity adhesive heatsink thermal pads

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