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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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10 Years
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Home / Products / Thermal Conductive Pad / Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking /

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Phase Changing Materials

 [36]

Thermal Conductive Pad

 [153]

Thermal Gap Filler

 [168]

Thermal Conductive Grease

 [27]

Thermal Insulation Materials

 [32]

Thermal Graphite Sheet

 [51]

Thermal Adhesive Tape

 [47]

Thermal Conductive Glue

 [15]

Thermal Conductive Adhesive

 [13]

Thermal Conductive Plastic

 [23]

Sponge Foam Material

 [13]

PET Double Sided Tape

 [11]

Thermal Gap Pad

 [406]

Thermal Conductive Gel

 [20]

Silicone Foam Gasket

 [11]

Silicone Free Gap Filler Pad

 [13]

Shielding Absorbing Materials

 [19]

Thermal Conductivity Sharp Metal

 [2]
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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking
Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking
  • Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking
  • Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking
Products Detailed
Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking The TIF™100-10E thermally conductive ...
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Product Tags:
heatsink cooling thermal conductive silicone pad thermal gap filler pad heatsink thermal pads

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