Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

Manufacturer from China
Verified Supplier
11 Years
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2.0W Thermal Conductivity Silicon Pad 1mm Thickness Silicon Insulation Pads Cooling Gap Filler Silicone PADS For GPU CPU

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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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2.0W Thermal Conductivity Silicon Pad 1mm Thickness Silicon Insulation Pads Cooling Gap Filler Silicone PADS For GPU CPU

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Brand Name :ZIITEK
Model Number :TIF140-20-19F
Certification :UL and RoHs
Place of Origin :China
MOQ :1000pcs
Price :negotiation
Supply Ability :100000pcs/day
Delivery Time :3-5work days
Packaging Details :1000pcs/bag
Product name :2.0W Thermal Conductivity Silicon Pad 1mm Thickness Silicon Insulation Pads Cooling Gap Filler Silicone PADS For GPU CPU
Color :Yellow
Thermal conductivity :2.0W/mK
Hardness :60 Shore 00
Operating temp :-45~200℃
Flame rating :94-V0
Keywords :Thermal Insulation Pads
Application :GPU CPU Chip Display Card Heat Transfer
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2.0W Thermal Conductivity Silicon Pad 1mm Thickness Silicon Insulation Pads Cooling Gap Filler Silicone PADS For GPU CPU

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

The TIF®140-20-19F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features:

> Good thermal conductive: 2.0W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF®140-20-19F Series
Property Value Test method
Color Yellow ******
Construction &Compostion Ceramic filled silicone elastomer ******
Specific Gravity 2.7 g/cc ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0MM) ASTM D374
Hardness 60 Shore 00 ASTM 2240
Operating Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant @1MHz 5.0 MHz ASTM D150
Volume Resistivity 1.0X1012 Ohm-meter ASTM D257
Flame rating 94 -V0 UL E331100
Outgassing (TML) 0.40% ASTM E595
Thermal conductivity 2.0 W/m-K ASTM D5470


Product Specification


Product Thicknesses:

0.020-nch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied.Please contact us for confirming.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF series sheets type can add with fiberglass reinforced.
2.0W Thermal Conductivity Silicon Pad 1mm Thickness Silicon Insulation Pads Cooling Gap Filler Silicone PADS For GPU CPU

Company profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

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