
Add to Cart
Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC
The TIF140FG-05S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features:
> Good thermal conductive: 1.5 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> RoHS compliant
> UL recognized
> Easy release construction
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
Typical Properties of TIF140FG-05S Series | ||
Property | Value | Test method |
Color | Blue | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Density | 2.3g/cm³ | ASTM D297 |
Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
Hardness | 27±5 Shore 00 | ASTM 2240 |
Continuos Use Temp | -45 to 200℃ | ****** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant | 4.5 MHz | ASTM D150 |
Volume Resistivity(Ohm-cm) | 1.0X1012 | ASTM D257 |
Fire rating | 94 V0 | UL equivalent |
Thermal conductivity | 1.5W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated