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Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC

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Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC

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Brand Name :ZIITEK
Model Number :TIF140FG-05S
Certification :UL and RoHs
Place of Origin :China
MOQ :1000pcs
Price :negotiation
Supply Ability :10000/day
Delivery Time :3-5work days
Packaging Details :1000pcs/bag
Products name :Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC
Thermal conductivity :1.5 W/m-K
Volume Resistivity :1.0X10¹² Ohm-meter
Dielectric Constant :4.5 MHz
Hardness :55 Shore00
Keywords :Thermal Gap Filler Pad
Material :silicone based with fiberglass feinforced
Application :Tablet PC ,CPU
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Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC

The TIF140FG-05S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features:


> Good thermal conductive: 1.5 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized
> Easy release construction


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

Typical Properties of TIF140FG-05S Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density 2.3g/cm³ ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ASTM D374
Hardness 27±5 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X1012 ASTM D257
Fire rating 94 V0 UL equivalent
Thermal conductivity 1.5W/m-K ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:
16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced  For Tablet PC

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

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