Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

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Brand Name :ZIITEK
Model Number :TIF035-05
Certification :UL and RoHs
Place of Origin :China
MOQ :1000pcs
Price :negotiation
Supply Ability :10000/day
Delivery Time :3-5work days
Packaging Details :600cc/tube
Specific Gravity :3.0 g/cc
viscosity :2000,000cps
Dielectric breakdown strength :200V/mil
Fire rating :94-V0
Color :blue
Continuous Use Temp :-45-200 ℃
Good thermal conductive :3.5 W/mK
Outgassing,%TML :0.80%
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New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

TIF035-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF035-05 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF035-05 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-35 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

TIF035-05 Series Datasheet-REV02.pdf

Application

>Heat-sink & frame

>LED backlight module,LED lighting

>High speed hardware driver

>Micro heat pipe ,Vihicel enginee controler

>Telecom industry

Feature

>Thermal conductivity: 3.5W/mK

>Soft, very low compression

>Operate automaticly

TIF035-05 Property
Color Blue Visual
Construction & Composition Ceramic filled silicon material **********
Viscosity 2000,000cps GB/T 10247
Specific Gravity 3.0 g/cc ASTM D297
Thermal conductivity 3.5 W/mK ISO 22007-2
Thermal diffusivity 1.1073 mm2/s ISO 22007-2
Specific heat capacity 3.3 MJ/m3K ISO 22007-2
Continuous Use Temperature -45 ~200°C ******
Dielectric breakdown strength 200 V/mil ASTM D149
Flame Rating 94V0 E331100
Outgassing,%TML 0.80% ASTM E595

Package :

Product Specification:

•30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.

New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

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