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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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10 Years
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Home / Products / Thermal Adhesive Tape / PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors /

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Phase Changing Materials

 [37]

Thermal Conductive Pad

 [155]

Thermal Gap Filler

 [185]

Thermal Conductive Grease

 [27]

Thermal Insulation Materials

 [33]

Thermal Graphite Sheet

 [53]

Thermal Adhesive Tape

 [47]

Thermal Conductive Glue

 [15]

Thermal Conductive Adhesive

 [13]

Thermal Conductive Plastic

 [23]

Sponge Foam Material

 [13]

PET Double Sided Tape

 [11]

Thermal Gap Pad

 [406]

Thermal Conductive Gel

 [21]

Silicone Foam Gasket

 [11]

Silicone Free Gap Filler Pad

 [13]

Shielding Absorbing Materials

 [19]

Thermal Conductivity Sharp Metal

 [2]
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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
  • PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
  • PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
Products Detailed
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used ...
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Product Tags:
high thermal conductivity adhesive pcb heat conducting adhesive thermally conductive adhesive transfer tape

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