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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

Manufacturer from China
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10 Years
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Home / Products / Thermal Conductive Pad / High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules  /

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Product Categories

Phase Changing Materials

 [37]

Thermal Conductive Pad

 [155]

Thermal Gap Filler

 [189]

Thermal Conductive Grease

 [27]

Thermal Insulation Materials

 [33]

Thermal Graphite Sheet

 [53]

Thermal Adhesive Tape

 [47]

Thermal Conductive Glue

 [15]

Thermal Conductive Adhesive

 [13]

Thermal Conductive Plastic

 [23]

Sponge Foam Material

 [13]

PET Double Sided Tape

 [11]

Thermal Gap Pad

 [406]

Thermal Conductive Gel

 [22]

Silicone Foam Gasket

 [11]

Silicone Free Gap Filler Pad

 [13]

Shielding Absorbing Materials

 [19]

Thermal Conductivity Sharp Metal

 [2]
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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
  • High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
  • High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules 
Products Detailed
High Quality 3.0W Thermal Conductive Pad With Fiberglass Reinforced Gap Filler Pad For Memory Modules The TIF™340 is not only designed to take ...
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Product Tags:
thermal conductive pads thermal interface material pad polystyrene xps insulation board

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