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Dongguan Ziitek Electronic Materials & Technology Ltd.

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City:dongguan

Province/State:guangdong

Country/Region:china

Contact Person:MsDana Dai

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China Blue Color Electronic Thermal Gap Filler , Gpu Ic Chip Thermal Conductive Pad wholesale

Blue Color Electronic Thermal Gap Filler , Gpu Ic Chip Thermal Conductive Pad

Name: Blue Color Electronic Thermal Gap Filler Gpu Ic Chip Thermal Conductive Pad
Brand: ZIITEK
Price: 1 USD

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Brand Name :ZIITEK

Model Number :TIF5100S

Certification :UL and RoHs

Place of Origin :China

MOQ :1000pcs

Price :negotiation

Supply Ability :10000/day

Delivery Time :3-5work days

Packaging Details :1000pcs/bag

thickness :2.5mmT

Color :blue

NAME :TIF5100S

keywords :thermal gap filler

feature :for gpu ic chip thermal gap filler

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Blue Color Electronic Thermal Gap Filler , Gpu Ic Chip Thermal Conductive Pad

The TIF5100S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features:

> Thickness: 2.5 mmT
> Good thermal conductive: 3 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies size

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF™5100S
Color	blue	Visual	Composite Thickness	hermalImpedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone rubber	***	10mils / 0.254 mm	0.21
			20mils / 0.508 mm	0.27
Specific Gravity	2.01 g /cc	ASTM D297	30mils / 0.762 mm	0.39
			40mils / 1.016 mm	0.43
Heat Capacity	1 l /g-K	ASTM C351	50mils / 1.270 mm	0.50
			60mils / 1.524 mm	0.58
Hardness	45 Shore 00	ASTM 2240	70mils / 1.778 mm	0.65
			80mils / 2.032 mm	0.76
Tensile Strength	40 psi	ASTM D412	90mils / 2.286 mm	0.85
			100mils / 2.540 mm	0.94
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	1.00
			120mils / 3.048 mm	1.07
Dielectric Breakdown Voltage	>1500～>5500 VAC	ASTM D149	130mils / 3.302mm	1.16
			140mils / 3.556 mm	1.25
Dielectric Constant	5.5 MHz	ASTM D150	150mils / 3.810 mm	1.31
			160mils / 4.064 mm	1.38
Volume Resistivity	6.3X1012Ohm-meter	ASTM D257	170mils / 4.318 mm	1.43
			180mils / 4.572 mm	1.50
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.60
			200mils / 5.080 mm	1.72
Thermal conductivity	3.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.

Blue Color Electronic Thermal Gap Filler , Gpu Ic Chip Thermal Conductive Pad

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