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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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7W/MK Thermal Conductive Gap Filler thermal pads For High Speed Mass Storage Drivers

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Thermal Graphite Sheet

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Thermal Conductive Adhesive

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Thermal Conductive Plastic

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Sponge Foam Material

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PET Double Sided Tape

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Thermal Gap Pad

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Thermal Conductive Gel

 [22]

Silicone Foam Gasket

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Silicone Free Gap Filler Pad

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Shielding Absorbing Materials

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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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China 7W/MK Thermal Conductive Gap Filler thermal pads For High Speed Mass Storage Drivers wholesale
  • China 7W/MK Thermal Conductive Gap Filler thermal pads For High Speed Mass Storage Drivers wholesale
  • China 7W/MK Thermal Conductive Gap Filler thermal pads For High Speed Mass Storage Drivers wholesale

7W/MK Thermal Conductive Gap Filler thermal pads For High Speed Mass Storage Drivers
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Brand Name :ZIITEK
Model Number :TIF780Z
Certification :UL and RoHs
Place of Origin :China
MOQ :1000pcs
Price :negotiation
Payment Terms :T/T
Supply Ability :10000/day
Delivery Time :3-5work days
Packaging Details :1000pcs/bag
Products name :7W/MK Thermal Conductive Gap Filler thermal pads For High Speed Mass Storage Drivers
Thickness :2 mmT
Specific Gravity :3.45 g/cc
Color :Gray
Operating temp :-40~200℃
flame rating :94 V0
Applications :High Speed Mass Storage Drivers
Keywords :Thermal Conductive Gap Filler
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View Product Description

7W/MK Thermal Conductive Gap Filler thermal pads For High Speed Mass Storage Drivers


Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products and so on, for various applications.

The TIF™780Z Series tis a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
7W/MK Thermal Conductive Gap Filler thermal pads For High Speed Mass Storage Drivers
Features:

> RoHS compliant 7 W/mK
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
> Electrically isolating
> High durability


Applications:
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Typical Properties of TIF780Z Series
Color GRAY Visual
Construction &Compostion Ceramic filled silicone rubber ***
Specific Gravity 3.45g/cc ASTM D297
Heat Capacity 1 l /g-K ASTM C351
Hardness 55 Shore 00 ASTM 2240
Tensile Strength 45 psi ASTM D412
Continuos Use Temp -40 to 200℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 5.2X10¹³ Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 7.0 W/m-K ASTM D5470
Standard Thicknesses:
0.010" (0.25mm), 0.020" (0.51mm), 0.030" (0.76mm), 0.040" (1.02mm),
0.050" (1.27mm), 0.060" (1.52mm), 0.070" (1.78mm), 0.080" (2.03mm),
0.090" (2.29mm), 0.100" (2.54mm), 0.110" (2.79mm), 0.120" (3.05mm),
0.130" (3.30mm), 0.140" (3.56mm), 0.150" (3.81mm), 0.160" (4.06mm),
0.170" (4.32mm), 0.180" (4.57mm), 0.190" (4.83mm), 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
7W/MK Thermal Conductive Gap Filler thermal pads For High Speed Mass Storage Drivers
Packaging Details & Lead time

The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

Our services


Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.

Product Tags:

hot plugging sata

thermal heatsink transfer pad

is sata hot pluggable
Inquiry Cart 0
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