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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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11 Years
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Home / Products / Thermal Gap Pad / Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook /

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Phase Changing Materials

 [42]

Thermal Conductive Pad

 [234]

Thermal Gap Filler

 [227]

Thermal Conductive Grease

 [28]

Thermal Insulation Materials

 [47]

Thermal Graphite Sheet

 [52]

Thermal Adhesive Tape

 [47]

Thermal Conductive Glue

 [15]

Thermal Conductive Adhesive

 [14]

Thermal Conductive Plastic

 [23]

Sponge Foam Material

 [13]

PET Double Sided Tape

 [11]

Thermal Gap Pad

 [406]

Thermal Conductive Gel

 [25]

Silicone Foam Gasket

 [13]

Silicone Free Gap Filler Pad

 [13]

Shielding Absorbing Materials

 [19]
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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook
Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook
  • Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook
  • Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook
Products Detailed
new type Moldability for complex parts UL recognized 3.0 W/mK thermal conductive pad for notebook,2.5mmT The TIF1100-30-06US ​ use a special process, ...
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Product Tags:
thermaltake micro atx case ksd9700 series thermal protector thermal conductivity silicon

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