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Dongguan Ziitek Electronic Materials & Technology Ltd.

Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer

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10 Years
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Home / Products / Thermal Gap Pad / 3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook /

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Phase Changing Materials

 [37]

Thermal Conductive Pad

 [155]

Thermal Gap Filler

 [189]

Thermal Conductive Grease

 [27]

Thermal Insulation Materials

 [33]

Thermal Graphite Sheet

 [53]

Thermal Adhesive Tape

 [47]

Thermal Conductive Glue

 [15]

Thermal Conductive Adhesive

 [13]

Thermal Conductive Plastic

 [23]

Sponge Foam Material

 [13]

PET Double Sided Tape

 [11]

Thermal Gap Pad

 [406]

Thermal Conductive Gel

 [22]

Silicone Foam Gasket

 [11]

Silicone Free Gap Filler Pad

 [13]

Shielding Absorbing Materials

 [19]

Thermal Conductivity Sharp Metal

 [2]
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Dongguan Ziitek Electronic Materials & Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook
3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook
  • 3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook
  • 3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook
Products Detailed
3.2 W/mK High Tack Surface Reduces Contact Resistance Thermal pad for Notebook The TIF1140-32-05US use a special process, with silicone as the base ...
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Product Tags:
thermal interface material pad thermal conductive pad 2mm thermal interface pad

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