Dongguan Ziitek Electronic Materials & Technology Ltd.

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4.5mm UL Recognized Low Cost Thermal Gap Pad For Notebook

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4.5mm UL Recognized Low Cost Thermal Gap Pad For Notebook

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Brand Name :ZIITEK
Model Number :TIF1180N-50-10F thermal pad
Certification :UL and RoHs
Place of Origin :China
MOQ :1000pcs
Price :negotiation
Supply Ability :100000pcs/day
Delivery Time :3-5 work days
Packaging Details :1000pcs/bag
Color :Gray
hardness :55±5 shore 00
part number :TIF1180N-50-10F
Applications :Heat pipe thermal solutions
name :4.5mmT UL Recognized Low Cost Thermal Pad for Notebook
keyword :thermal gap pad
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4.5mmT UL Recognized Low Cost Thermal Pad for Notebook​

The TIF1180N-50-10F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100N-40-10F-Specification-sheet.pdf

Features

> Good thermal conductive: 5.0 W/mK

>Thickness: 4.5mmT

>hardness:55±5 shore 00

>Colour: Gray

>Available in varies thicknesses
>Broad range of hardnesses available
>Moldability for complex parts

Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF1180N-50-10F Series
Color
Gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.1 g/cm3

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
4.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

55±5 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity
5.0W/mk
ISO22007-2.2
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.7 MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

5.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

4.5mm UL Recognized Low Cost Thermal Gap Pad For Notebook

FAQ:

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

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