Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer
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Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance
The TIF7140Z use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF700Z-Series-Datasheet(E)-REV01.pdf
Features
> Good thermal conductive: 7.0 W/mK
> Thickness: 3.5mmT
> hardness:55 shore 00
> Colour: Grey
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
Applications
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
| Typical Properties of TIF7140Z Series | ||||
| Color | Grey | Visual | Composite Thickness | Thermal Impedance@10psi (℃-in²/W) |
| Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
| 20mils / 0.508 mm | 0.20 | |||
| Specific gravity | 3.45 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
| 40mils / 1.016 mm | 0.36 | |||
| Thickness | 3.5mmT | *** | 50mils / 1.270 mm | 0.42 |
| 60mils / 1.524 mm | 0.48 | |||
| Hardness | 55 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
| 80mils / 2.032 mm | 0.63 | |||
| Thermal conductivity | 7.0W/mk | ASTMD5470 | 90mils / 2.286 mm | 0.73 |
| 100mils / 2.540 mm | 0.81 | |||
| Continuos Use Temp | -40 to 200℃ | *** | 110mils / 2.794 mm | 0.86 |
| 120mils / 3.048 mm | 0.93 | |||
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
| 140mils /3.556 mm | 1.08 | |||
| Dielectric Constant | 4.5MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
| 160mils / 4.064 mm | 1.20 | |||
| Volume Resistivity | 5.2X1013 Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
| 180mils / 4.572 mm | 1.32 | |||
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
| 200mils / 5.080 mm | 1.52 | |||
| Thermal conductivity | 7.0 W/m-K | GB-T32064 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
Q: What is your terms of payment ?
A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.