Dongguan Ziitek Electronic Materials & Technology Ltd.

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High Thermal Conductivity Adhesive Silicone Thermal Pads with 7.0 W/mK thermal conductive

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High Thermal Conductivity Adhesive Silicone Thermal Pads with 7.0 W/mK thermal conductive

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Brand Name :ZIITEK
Model Number :TIF7140HZ thermal pad
Certification :UL
Place of Origin :China
MOQ :1000pcs
Price :negotiation
Supply Ability :100000pcs/day
Delivery Time :3-5 work days
Packaging Details :1000pcs/bag
Name :High Thermal Conductivity Adhesive Silicone Thermal Pads with 7.0 W/mK thermal conductive
Thickness :3.5mmT
Material :silicone
Thermal conductivity :7.0 W/m-K
Applications :GPU CPU Cooling
keyword :Silicone Thermal Pads
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High Thermal Conductivity Adhesive Silicone Thermal Pads with 7.0 W/mK thermal conductive

Ziitek TIF7140HZ is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling

TIF700HZ-Series-Datahseet.pdf

High Thermal Conductivity Adhesive Silicone Thermal Pads with 7.0 W/mK thermal conductive

Features

> Good thermal conductive: 7.0 W/mK

> Thickness: 3.5mmT

> hardness:55±5

> Colour: Blue

> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance

Applications

> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

Typical Properties of TIF7140HZ Series
Color
Blue
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.45 g/cc

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
3.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

55±5

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity
7.0W/mk
ASTMD5470
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.5MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

7.0 W/m-K

GB-T32064
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

High Thermal Conductivity Adhesive Silicone Thermal Pads with 7.0 W/mK thermal conductive

FAQ:

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

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