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Phase Change Material PCM
TIC™805A-AL series is low melting point thermal interface material. At 50℃, TIC™805A-AL series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.
TIC™805A-Al series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
TIC™805A-AL Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Applications Include:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Features:
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Typical Properties of TICTM800A-AL Series | |||||
Product Name | TICTM805A-AL | TICTM808A-AL | TICTM810A-AL | TICTM820A-AL | Test Method |
Color | Gray / Silve | Gray / Silver | Gray / Silver | Gray / Silver | Visual |
Thickness | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.020" (0.508mm) | |
Thickness Tolerance | ±0.0008'' (±0.019mm) | ±0.0008'' (±0.019mm) | ±0.0012'' (±0.030mm) | ±0.0020'' (±0.050mm) | |
Density | 2.5g/cc | Helium Pycnometer | |||
Temperature range | -25℃~125℃ | ||||
Phase Change Softening Temperature | 50℃~60℃ | ||||
Thermal Conductivity | 2.5 W/mK | ASTM D5470 (modified) | |||
Thermal Impedance @ 50 psi(345 KPa) | 0.063℃-in²/W | 0.08℃-in²/W | 0.097℃-in²/W | 0.157℃-in²/W | ASTM D5470 (modified) |
0.40℃-cm²/W | 0.52℃-cm²/W | 0.63℃-cm²/W | 1.13℃-cm²/W |
Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.020"(0.508mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm)
TIC™800 series are supplied with a white release paper and a bottom liner.
TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.
Reinforcement:
No reinforcement is necessary.
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .