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High Thermal Conductivity 25w/MK Carbon Based Thermal Sheet Thermal Pad For 5G Communication Equipment
TS-TIR®700-25 Series series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achievese xceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.
Feature
>Good thermal conductivity 25w/mK
>Ultra-low thermal resistance
>works under low pressure.
>Non-insulating material
>Non-adhesive surface
Application
>Between chips and heat dissipation modules
>5G communication equipment
>Optoelectronics industry
>wearable devices
Typical Properties of TIR®700-25 series | |||
Product Name | TIR®700-25 | Test Method | |
Colour | Gray | Visual | |
Construction | Carbon fiber filled silicone | ***** | |
Thickness range | 0.01"~0.04" (0.3~1.0 mm) | 0.06"~0.20"(1.5~5.0 mm) | ASTM D374 |
Hardness | 75±10 Shore 00 | 55±10 Shore 00 | ASTM D2240 |
Density | 2.9g/cm3 | ASTM D792 | |
Operation Temperature | -40℃~ 200℃ | ****** | |
Thermal impedance | 25.0W/m-K | ASTM D5470 | |
Specific heat capacity (J/g ℃) | 0.75 | ASTM E1269 @25℃ | |
Flame Rating | V-0 | UL94 | |
RoHS | Compliant | IEC62321 |
Product Specification
Standard Thickness:0.01" (0.3mm), 0.02"(0.5mm), 0.04"(1.0mm), 0.06" (1.5mm), 0.08" (2.0mm), 0.10" (2.5mm), 0.12" (3.0mm)
Standard Size: 1.97"×1.97"(50.0mm x 50.0mm)
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.