Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer
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Low Thermal Inpedance 9W/MK Silicone Thermal Congductive Gel For Vihicel Enginee Controler
Company Profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
TIF®090-11 is a soft silicone-based gap filler pad formulated with thermally conductive fillers and a unique compound that combines excellent themal performance with outstanding softness. Compared to conventional thermal grease,TIF®090-11 has a higher viscosity, effectively preventing the separation of fllers from the siliconebase. lt also offers more stable bond line control under pressure,enhancing product reliability. TIF®090-11 is applied similaty to traditional themal paste and is compatible with various commercial equipment,such as dispensing systems or automated production equipment. lt is suitable for a wide range of high-power electronic components and packaging formats, including flip-chip microprocessors (Flip-Chip MPU),PPGA, micro BGA,BGA,DSP chips, circular accelerator chips, and LED lighting modules.
Feature
> Thermal conductivity: 9.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler
> Telecom industry
> Semiconductor automatic laboratory equipment
| TIFTM090-11 Typical Property | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | ***** |
| Viscosity | 13000K mPa.s | GB/T 10247 |
| Specific Gravity | 3.45g/cm³ | ASTM D297 |
| Thermal conductivity | 9.0 W/mK | ASTM D5470 |
| Thermal resistance @10Psi(℃-in²/W) | 0.089 | ASTM D5470 |
| Thermal resistance @50Psi(℃-in²/W) | 0.055 | ASTM D5470 |
| Recommended Operating temp | -45~200℃ | ISO 22007-2 |
| Dielectric breakdown strength(V/mm) | ≥4000 | ISO 22007-2 |
| Bond line Thickness | 0.4 | ****** |
| D3-D10(Siloxane Content, ppm) | ＜100 | GC-MS |
| Flame Rating | V-0 | UL 94 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Independent R&D team
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Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL