Dongguan Ziitek Electronic Materials & Technology Ltd.
Dongguan Ziitek Electronic Materials & Technology Ltd. Professional TIM Manufacturer
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2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive
The TIC™803A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™803A Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features:
> 0.018℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
| Typical Properties of TIC™800A Series | |||||
| Product Name | TICTM803A | TICTM805A | TICTM808A | TICTM810A | Testing standards |
| Color | Ashy | Ashy | Ashy | Ashy | Visual |
| Composite Thickness | 0.003" (0.076mm) | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | |
| Thickness Tolerance | ±0.0006" (±0.016mm) | ±0.0008" (±0.019mm) | ±0.0008" (±0.019mm) | ±0.0012" (±0.030mm) | |
| Density | 2.5g/cc | Helium Pycnometer | |||
| Work Temperature | -25℃～125℃ | | |||
| phase transition temperature | 50℃~60℃ | | |||
| Setting temperature | 70℃ for 5 minutes | | |||
| Thermal conductivity | 2.5 W/mK | ASTM D5470 (modified) | |||
| Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa) | 0.018℃-in²/W | 0.020℃-in²/W | 0.047℃-in²/W | 0.072℃-in²/W | ASTM D5470 (modified) |
| 0.11℃-cm²/W | 0.13℃-cm²/W | 0.30℃-cm²/W | 0.46℃-cm²/W | ||
